Dow corning SE4485 organic silicon ultra high conductivity adhesive, has good thermal conductivity, fast and no viscosity.
Good dielectric properties, self-adhesive and low stress, are used for the adhesion and insulation of heating elements.
Low volatility: when solidified, the smell is small;
High heat conductivity: high thermal conductivity, suitable for hot bonding.
Dealkyl: the by-product of solidification reaction is an alcohol-type, no corrosion to the base material.
Quick watch: increase productivity.
Versatility: good adhesion to most base materials.
Flame retardant performance: fire resistance through ul94-v0.
Suitable for high-calorie electronic devices such as communication power module.
The performance parameters
Method of use
Clean surface: it is cleaned by the surface of the sticky substance, ensuring that the surface is dry, no oil, no dust.
Glue: apply glue to the adhesive surface and press together.
Solidification: dry 24-120 hours to ensure maximum adhesion strength.
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