Dow corning SE4450 conductive adhesive belong to fast curing high heat conductive organic silicone.
Heating solidification: heating rapidly solidifies, increasing production efficiency.
High thermal conductivity: high thermal conductivity.
Apply to the occasion where heat transfer is required.
High heat conductivity
Curing time is short
4. High and low temperature resistance (- 45 ~ 250 ℃)
Suitable for calorific value of electronic equipment and the need to control the curing speed of occasions, such as: power supply, ink jet print head, the computer (ECU) of driving, driving IC and heat sink adhesive, etc.
Has good thermal conductivity and heat transfer effect, there are paste grease, have both heat conduction and then the two functions of rubber adhesives, there are also products for perfusion of two-component model of thermal conductive materials normalized gasket etc.
The performance parameters
Method of use
Pretreatment: the substrate surface should be cleaned and dried.
The use of corona can improve the adhesion effect.
2, the glue: pressure pressure pressure on the pressure of the pressure is applicable.
3, cure: SE4450 cured at 150 ℃ heating.
rofessional provide adhesive solution, technical support please consult